Multi-layer thick film technology stacks conductors, resistors, and dielectrics on substrates, creating dense, high-functionality circuits in tiny spaces. Each layer is screen-printed—conductors for connectivity, dielectrics for insulation, resistors for function—dried, and fired at 850°C. This enables high power density, making it ideal for wearables, biosensors, and complex hybrid circuits.
Ceramic substrates like alumina (cost-effective) or aluminum nitride (heat-conductive) dominate, offering thermal stability and strength. Vias—small conductive-filled holes—link layers, enabling 3D designs. Benefits include reduced size, integrated components, and resilience in harsh conditions like automotive or aerospace settings.
Challenges are significant: layer alignment requires precision (missteps cause shorts), and thermal mismatches can crack stacks. Dielectrics must handle high voltages, especially in heaters. A Scientific Digest study notes its growth in IoT, where compactness is king. Applications include wearables packing sensors and power, biosensors with onboard processing, and heaters layering heating elements.
Design tips? Sequence layers logically (conductors first), simulate thermal loads, and test compatibility. Multi-layer thick film isn’t just stacking—it’s a strategic build for maximum impact in minimal space.