Our Capabilities



At CMS Circuits, we provide accurate, reliable, and cost effective solutions for custom thick film substrate manufacturing. We use the newest available technologies for precision screen printing conductive, resistive, and insulating pastes and fusing them at high temperatures onto a ceramic substrate. We manufacture thick film substrates with multiple layers and ceramic vias that can be coated or filled with various conductive materials. Using screen printing technology, we can produce 0.004” lines with 0.004” spacing, and for applications where tighter spacing is required, we can etch line widths of 0.001” with 0.001” spacing. Our standard substrate materials include alumina, aluminum nitride, and beryllium oxide as well as sapphire and ferrite.  

Thick Film Screen Printing

This technology is used in demanding applications where long life, thermal endurance, mechanical strength, thermal conductivity, high density electrical interconnection, low dielectric losses, etc., are needed


  • Through hole connections from front to back of ceramic standard process
  • Screen printed resistors on both front and back is standard process
  • Gold conductors can be wire bonded with both gold wire and/or alumina wire
  • Solderable metallization is available that can be integrated with gold wire bondable conductors

Etched Thick Film

For product with much tighter spacing requirements, etched thick film substrates are the best solution and are more cost effective.


  • Etched standard 2 mil lines and spaces (1 mil lines special request) on gold. Etched Gold Thick Film has better insertion loss at higher frequencies than comparable Thin Film RF circuits
  • Lange couplers available that do not require wire bonding to tie coupler elements together
  • Silver etching available

Multilayer Thick Film Screen Printing

These substrates consist of screen printed conductor layers, separated by dielectric layers, which can be interconnected by vias. This allows high density interconnection.


  • Ten layers or more available with our standard process
  • 10 mil square vias or larger available with our standard process
  • Dielectrics available that will allow intermixing of gold and silver metallization
  • Multilayer capability both front and back with through hole interconnections

Custom/Specialty Applications

When standard thick film processes aren’t able to work with a design, multiple processes can be incorporated to achieve strict design requirements.


  • Etch layer on top of multilayer
  • Etching available on all metal layers of a multilayer structure
  • Photo imageable dielectrics available for multilayer structures
  • Integrated resistors and capacitors available with etch technology

Fundamentals of Thick Film