Capabilities at CMS Circuits: Precision Thick-Film Hybrid Microelectronics Built for the Extreme

At CMS Circuits, we don’t manufacture standard printed circuit boards, we engineer thick-film hybrid microelectronics on ceramic substrates that deliver unmatched performance in environments where conventional organic PCBs (like those from Sierra Circuits or other FR4-based providers) simply cannot survive.

While many PCB manufacturers focus on rigid, flex, HDI, or high-speed digital boards using organic laminates, our vertically integrated facility in Murrieta, California specializes in ceramic-based solutions engineered for high-reliability, high-temperature, high-power, harsh-environment, and mission-critical applications.

Every step from paste formulation and screen printing to laser processing, assembly, and final testing happens under one roof with complete material traceability.

This level of control gives aerospace, defense, medical, semiconductor, and space customers the confidence that their components will perform exactly as designed, even under extreme stress.

Key Technical Highlights

60+

layers

1.25 µm

layer thickness

0.002 inch

line/space

Substrates

Ceramic, metal, flexible

Integrated

passives, compact

Core Expertise: Thick-Film Manufacturing

Thick-film technology is the foundation of our process. We precisely deposit conductor, resistor, and dielectric pastes through custom stainless-steel mesh screens onto ceramic substrates, then dry and fire them at high temperatures to create integrated, highly stable circuits.

Screen Printing

Large-Format Printing

We use precision screen printing for repeatable deposition of thick-film inks. This enables multilayer builds with integrated passives - no need for discrete resistors or capacitors. Benefits include excellent adhesion, long-term stability, and cost-effective scaling from prototypes to high-volume production.

Ideal for hybrid circuits, ceramic heaters, sensors, and power modules.

We print on oversized panels (29"x29") for efficient multi-up panelization. This reduces per-unit costs at scale while maintaining uniform deposition across large areas perfect for power modules, large-area heaters, and sensor arrays.

The result? Highly reliable circuits that are more thermally stable and mechanically robust than standard etched copper PCBs.

Hybrid Microelectronics & Advanced Processes

Our hybrid circuits combine thick-film layers with bare-die attachment, wire bonding, and SMT components to create compact, high-performance modules. All advanced processes are performed in-house for complete control.

Laser Etching / Ablation

Laser Cutting

Laser Resistor Trimming

Via Filling & Plating

Inert-Atmosphere Firing

Conformal Coating & Globtopping

Precision Dicing

Non-contact laser removal of material for fine patterning with sub-50 µm resolution and clean edges. Perfect for high-frequency RF circuits and precision features in aerospace and defense electronics.

CO₂ or fiber lasers cut ceramics into complex shapes without mechanical stress or chipping. This ensures high yield and tight tolerances for custom outlines and panel singulation.

Pulsed YAG lasers perform L-cuts or plunge cuts while measuring resistance in real time. We adjust initial tolerances from ±20% down to ±0.1% or better, dramatically improving stability and temperature coefficient of resistance (TCR).

Critical for precision sensors and circuits in medical devices and aerospace.

We fill laser-drilled or punched vias with conductive paste (or plate them) to create reliable z-axis interconnects. This enables true 3D multilayer density in complex hybrid designs.

High-temperature belt furnaces run in nitrogen or inert gas prevent oxidation of base-metal pastes. This allows lower-cost, high-conductivity traces (e.g., copper) and advanced multilayer builds.

We apply protective polymer layers (silicone, parylene, urethane) or epoxy globtops over sensitive components. This shields against moisture, chemicals, vibration, and shock—essential for defense and harsh-environment applications.

Diamond-blade or laser dicing separates multi-circuit panels with clean, burr-free edges and minimal substrate damage for maximum yield.

These processes give our customers design flexibility and reliability that standard PCB fabrication cannot match.

Substrate Materials Engineered for Performance

We select the optimal ceramic substrate based on your thermal, mechanical, electrical, and environmental requirements:

96% Alumina (Al₂O₃)
Excellent insulation, mechanical strength, cost-effective, perfect CTE match to pastes
Aluminum Nitride (AlN)
Ultra-high heat dissipation, low dielectric loss, non-toxic
Beryllium Oxide (BeO)
Highest thermal conductivity with excellent electrical insulation
Zirconia (ZrO₂)
Superior fracture toughness, thermal-shock resistance, biocompatible, corrosion resistant

Ceramic substrates far outperform organic PCBs in thermal conductivity and stability under extreme temperatures (-100°C to +800°C) and radiation.