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CMS Circuits specializes in thick film hybrid circuits, providing comprehensive solutions from circuit fabrication to final product assembly. By combining advanced ceramic substrate technology with precision thick film processes and full electronic manufacturing services, we deliver reliable, high-performance electronic modules for demanding applications.

Specific Product Type & Description and What It’s Good For

Laser-trimmable integrated resistor arrays on ceramic substrates offering ±0.1% tolerance, ultra-low TCR, and long-term stability. Benefits: eliminates discrete components, reduces size/weight. Used in aerospace sensors, defense instrumentation, and medical devices.

Precision Resistor Networks

Printed resistive heater elements directly on alumina or AlN substrates for uniform heating up to 500°C+. Benefits: high watt density, direct thermal coupling, integrated sensing. Used in medical diagnostic equipment, aerospace de-icing, and defense thermal management.

Ceramic Heaters

Screen-printed multilayer circuits with vias, crossovers, and integrated passives. Benefits: highest density packaging, hermetic sealing, extreme durability. Used in avionics computers, missile guidance systems, and implantable medical electronics.

Multilayer Hybrid Modules

Fritless-gold or high-conductivity traces with laser-etched fine lines. Benefits: low loss, excellent solder/wire-bond pads, stable to 20+ GHz. Used in radar, satellite communications, and medical RF sensors.

RF / Microwave Circuits

High-power AlN or BeO-based modules with thick-film conductors and integrated resistors. Benefits: superior thermal dissipation and high current handling. Used in electric propulsion systems, defense radar transmitters, and medical imaging power supplies.

Power Electronics Substrates

Printed piezo, strain-gauge, temperature, or other sensors combined with signal conditioning.

Integrated Sensor Assemblies

Flip-chip or wire-bonded silicon/GaN dies on printed substrates with globtop or hermetic sealing. Benefits: maximum miniaturization and reliability in harsh environments. Used in mission-critical defense and medical implantable devices.

Bare-Die Wirebonded Hybrids

Low-cost, highly functional multilayer circuits printed on flexible substrates. Benefits: bendable, lightweight, space-saving. Used in wearable medical devices, portable electronics, and curved aerospace components.

Multilayer Flexible Circuits

Conductive circuits screen-printed directly onto fabrics using polymer inks. Benefits: fully flexible, washable, conformable to body or structure. Used in smart textiles, wearable health monitors, and aerospace crew-wear sensors.

Fabric Printed Circuits

Low-temperature printing with polymer inks on flexible or rigid substrates. Benefits: cost-effective, lightweight, high-volume production. Used in disposable medical sensors, consumer wearables, and cost-sensitive industrial applications.

Polymer-Based Printed Circuits

Screen-printed conductors with integrated LEDs for indicators and lighting. Benefits: direct integration, uniform illumination, vibration-resistant. Used in medical instruments, aerospace cockpit panels, and defense equipment.

Printed LED Circuits & Modules

Circuits printed directly onto stainless steel, aluminum, or other metals. Benefits: combines mechanical strength with electronic functionality, excellent heat sinking. Used in rugged heaters, structural sensors, and industrial power modules.

Direct-to-Metal Printed Circuits

Specific Product Type & Description and What It’s Good For

High-speed pick-and-place SMT on standard FR4, flex, or ceramic hybrids with full reflow and selective soldering. Benefits: rapid turnaround, fine-pitch capability, and seamless integration of thick-film elements. Used in avionics control boards, defense electronics, and medical diagnostic instruments.

SMT & Mixed-Technology PCB Assemblies

Thick-film substrates populated with SMT components and wire-bonded dies, fully tested. Benefits: combines thick-film stability with standard assembly economics. Used where high-reliability and compact size are required (aerospace sensors, medical wearables).

Hybrid-Integrated Assemblies

Complete enclosure-level assembly including power supplies, displays, and environmental sealing. Benefits: single-source turnkey solution with full functional testing and serialization. Used in complete defense subsystems and medical device final assemblies.

Box-Build & System Integration

Specific Product Type & Description and What It’s Good For

Complete onshoring programs for medical devices moving from overseas suppliers. Benefits: Reduces tariffs and lead times, enables Made in USA labeling, strengthens supply chain security, and supports full regulatory compliance. Ideal for OEMs seeking domestic resilience.

Medical Device Onshoring & Tech Transfer

Biocompatible thick-film hybrids, sensors, and hermetic modules produced in ISO 7/8 cleanrooms. Benefits: FDA and ISO 13485 compliant, laser-trimmed precision, sterilization-ready. Used in pacemakers, heart monitors, neurostimulators, and implantable sensors.

Implantable Medical Subassemblies

Medical diagnostic modules and sterile final assemblies with validated sterilization processes. Benefits: Full traceability, PPAP approved, ready for clinical use. Supports rapid diagnostics and Class II/III devices.

Diagnostic & Sterile Assemblies

High-reliability thick-film and hybrid avionics boards with complete environmental qualification. Benefits: ITAR-compliant with full traceability.

Aerospace Avionics Modules

Ruggedized hybrid modules with integrated heaters and electronics. Benefits: MIL-STD qualified and scalable from prototype to production.

Defense Sensor & Power Subsystems

Full turnkey manufacturing including design support, assembly, testing, and packaging. Benefits: Single-source responsibility with complete regulatory and quality documentation.

Custom High-Reliability Products

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CMS Circuits

From prototype design to full-scale production, CMS Circuits delivers precision thick film hybrid circuits and complete electronic assemblies. Our expertise in ceramic substrates, microelectronic assembly, and final product integration ensures your designs meet the highest standards of performance and reliability.