Capabilities

CMS Circuits offers a comprehensive set of advanced manufacturing capabilities for high-reliability thick-film and hybrid microelectronics. From precision printing and laser processing to assembly, testing, and material integration, our vertically integrated processes are engineered to support complex, multilayer circuit designs. Each capability is optimized for performance, consistency, and scalability—ensuring reliable operation in aerospace, defense, medical, semiconductor, and other mission-critical applications.

Key Features Overview

60+

layers

1.25 µm

layer thickness

0.002 inch

line/space

Substrates

Ceramic, metal, flexible

SMT + wire

Precision deposition of thick-film pastes (conductors, resistors, dielectrics) through custom stainless-steel mesh screens onto substrates, followed by drying and firing. Enables multilayer builds with integrated passives. Benefits: highly cost-effective from prototype to high volume, excellent adhesion/stability, supports complex geometries and fine features. Used for hybrid circuits, heaters, sensors, and power modules in aerospace, defense, and medical devices.

Screen Printing

Screen printing on oversized panels/substrates (up to large production formats). Benefits: efficient multi-up panelization, reduced per-unit cost at scale, uniform large-area deposition. Used for power modules, large heaters, and sensor arrays.

Large Format Printing

Focused laser ablation selectively removes material from conductors or pastes for fine patterning. Benefits: non-contact, no tool wear, sub-50 μm resolution, clean edges. Used for high-frequency RF circuits and precision features in aerospace/defense electronics

Laser Etching

High-precision CO₂ or fiber laser cuts ceramic substrates or finished circuits. Benefits: complex shapes without mechanical stress or chipping, high yield, tight tolerances. Used for custom outlines and panel singulation.

Laser Cutting

Pulsed YAG laser removes precise amounts of fired resistor film (L-cuts, plunge cuts) while measuring resistance in real time. Benefits: adjusts ±20 % initial tolerance to ±0.1 % or better, improves stability and TCR. Critical for precision circuits in aerospace sensors and medical devices.

Laser Resistor Trimming

SMT Pick and Place

Full SMT and through-hole assembly using controlled reflow ovens, wave, and selective soldering. Benefits: repeatable high-quality solder joints, full compatibility with hybrid substrates. Core traditional EMS process for all production volumes.

Electronics Assembly / Solder / Reflow

High-temperature belt furnaces operated in nitrogen or inert atmosphere. Benefits: prevents oxidation of base-metal (e.g., copper) pastes, enables lower-cost high-conductivity traces and multilayer builds. Used for advanced, cost-optimized hybrids.

Inert Firing

Temperature-controlled environmental chamber paired with precision resistance measurement. Benefits: characterizes and qualifies Temperature Coefficient of Resistance across full operating range (-55 °C to +150 °C+). Ensures long-term stability in defense and medical applications.

TCR Chamber

Filling laser-drilled or punched holes in dielectric layers with conductive paste (or plating). Benefits: creates reliable z-axis interconnects for true 3D multilayer density. Used in complex hybrid circuits requiring stacked conductors.

Via Filling

Plating

Spray, dip, or selective application of thin polymer layers (silicone, parylene, urethane). Benefits: protects against moisture, chemicals, and vibration without adding bulk. Essential for harsh-environment electronics.

Conformal Coating

Automated dispensing and UV/thermal curing of epoxy over bare dies or sensitive components. Benefits: provides mechanical shock protection and environmental sealing. Used in vibration-heavy hybrid modules for defense applications.

Globtopping

Diamond-blade or laser dicing separates multi-circuit panels into individual units. Benefits: clean, burr-free edges with tight tolerances and minimal substrate damage. Used for high-yield production of ceramic-based hybrids.

Precision Dicing

High-resolution cameras scan assemblies for component placement, print quality, and solder defects. Benefits: fast, non-contact, 100 % inline defect detection. Standard for all production.

2D Optical Scan (AOI)

Adds volumetric 3D measurement of solder joints and components. Benefits: detects insufficient/excess solder, height variations, and lifted leads with superior accuracy.

3D Optical Scan (AOI)

Manual and microscopic examination per IPC standards. Benefits: human judgment for complex or subtle anomalies.

Visual Inspection

Laser or contact profilometry measures film, coating, or substrate thickness. Benefits: ensures process consistency and electrical/thermal performance.

Thickness Measurement

Measures roughness and cleanliness for bonding/solderability. Benefits: prevents assembly defects in high-rel applications.

Surface Finish Analysis

Measures roughness and cleanliness for bonding/solderability. Benefits: prevents assembly defects in high-rel applications.

Electronic Testing
(ICT / FCT / Flying Probe)

Precision LCR meters and bridges. Benefits: verifies integrated thick-film passives after trimming.

Resistance / Capacitance Testing

Thermal cycling, burn-in, and environmental stress screening. Benefits: qualifies long-term reliability (e.g., 2000+ cycles –40 °C to +145 °C) for aerospace, defense, and medical devices.

Temperature Controlled Chamber Testing

96% Alumina (Al₂O₃)

Ceramics

Standard high-purity ceramic with excellent electrical insulation, mechanical strength, and thermal conductivity (~16–25 W/m·K). Cost-effective with perfect CTE match to thick-film pastes. Ideal for the vast majority of hybrid circuits, sensors, resistors, and general-purpose modules in aerospace, defense, and medical devices.

Aluminum Nitride (AlN)

Ceramics

Ultra-high thermal conductivity (170–200 W/m·K), low dielectric loss, non-toxic. Provides superior heat dissipation without the toxicity of BeO. Perfect for high-power modules, heaters, RF circuits, and laser diode applications in aerospace and defense.

Beryllium Oxide (BeO)

Ceramics

Highest thermal conductivity among ceramics (~250–300 W/m·K) with excellent electrical insulation. Enables extreme power handling in compact designs. Used in legacy high-power military radar, microwave, and aerospace systems (requires special handling due to toxicity).

Zirconia (ZrO₂)

Ceramics

Exceptional mechanical strength, fracture toughness, thermal-shock resistance, and corrosion resistance. Rugged and biocompatible. Excellent for structural sensors, biomedical implants, high-stress defense components, and harsh-environment applications.

Conductor Inks

Silver-Palladium (Ag/Pd)

Conductor Inks

Alloyed for excellent migration resistance, high leach resistance, and reliable solderability. Balances conductivity with long-term stability. Standard choice for high-reliability solder-reflow applications in aerospace, defense, and medical modules.

Silver-Platinum (Ag/Pt)

Conductor Inks

Enhanced thermal/chemical stability and migration resistance over pure silver. Outstanding solder leach resistance. Ideal for harsh-environment circuits requiring long-term reliability in aerospace and medical devices.

Gold (Au)

Conductor Inks

Superior corrosion resistance, excellent wire-bondability (Al or Au), and high conductivity. Dense, defect-free films. Preferred for ultra-high-reliability wire-bonded hybrids, RF, sensors, and medical implants.

Platinum (Pt)

Conductor Inks

Extreme high-temperature stability and oxidation resistance. Good for harsh-environment interconnects. Used in high-temp sensors and power circuits for defense and aerospace.

Platinum-Gold (Pt/Au)

Conductor Inks

Combines excellent wire-bond strength with high stability and corrosion resistance. Fine-line capable. Ideal for high-frequency and high-reliability medical and aerospace hybrids.

Fritless Gold

Conductor Inks

Pure gold formulation without glass frit for maximum conductivity and density. Enables ultra-fine etching (down to 25–50 µm). Used for high-density RF and high-frequency communications circuits in aerospace and defense.

Silver-Palladium (Ag/Pd)

Conductor Inks

Ruthenium-based (RuO₂)

Resistor Inks

Standard ruthenium-oxide compositions offering wide resistivity range (1 Ω to MΩ/sq), excellent laser-trimmability, low noise, and stable TCR. Highly reliable after trimming. Core material for precision resistors and networks in aerospace sensors, medical instrumentation, and defense systems.

Palladium-based / Ruthenium-Palladium blends

Resistor Inks

Precious-metal formulations for ultra-low TCR and long-term stability. Excellent moisture and thermal-shock resistance. Used in mission-critical precision circuits requiring extreme stability (aerospace, defense, medical).

Partner With
CMS Circuits

From prototype design to full-scale production, CMS Circuits delivers precision thick film hybrid circuits and complete electronic assemblies. Our expertise in ceramic substrates, microelectronic assembly, and final product integration ensures your designs meet the highest standards of performance and reliability.